features mechanical specification data sheet no. GP50PF-1A 50 amp press fit high voltage diodes (gpp die) tel.: (310) 767-1052 fax: (310) 767-7958 diotec electronics corp gardena, ca 90248 u.s.a 18020 hobart blvd., unit b mechanical data case: nickel plated copper finish: all external surfaces are corrosion resistant and the contact areas are readily weldable or solderable maximum soldering temperature: 250 c, 0.25" from case for 10 seconds mounting position: any. maximum force used for diode insertion to be 12 kn polarity: color coded epoxy ring- o anode on lead (beige ring): part no.=gp5002pfa/ cathode on lead (black ring) part no.=gp5002pfc/ gp5004pfa. gp5004pfc. part no. marked on cap base. glass passivated square die 0.180 ? 78 placesequally spaced 0.007 ? 0.005 ? 70 typ. all dimensions in inches gp5004a dt 0452 0.052 0.002 ? ? + _ 0.505 /502 ? ? over knurl 1.00? min 0.401 ? 0.385 ? 0.173 ? 0.157 ? 0.012 ? 0.008 ? 0.194 ? 0.184 ? maximum ratings & electrical characteristics ratings at 25 c ambient temperature unless otherwise specified. non-repetitive peak forward surge current (half wave, single phase, 60 hz sine applied to rated load) average forward rectified current 50 i o i fsm non-repetitive peak reverse voltage (half wave, 60 hz, single phase) parameter (test conditions) maximum recurrent peak reverse voltage maximum dc blocking voltage working peak reverse voltage series number v rsm v rwm v dc v rrm symbol 240600 600 ratings 50 amps 480 400 200 gp5004pfa gp5004pfc gp5002pfa gp5002pfc units volts forward voltagedrop <1.05<1.20 <1.05<1.20 volts maximum dc reverse current at rated blocking voltage tc = 25 c) o i r <1.0 <1.0 m a junction operating & storage temperature range t ,t j stg -65 to +200 -65 to +200 c rohs compliant @ 50amp dc (typical) @ 100amp dc (typical) void free vacuum die soldering for maximum mechanical strength and heat dissipation (solder voids: typical < 2%, max. < 5% of die area) full silicon die area on p- and n-sides are soldered to copper slugs for minimum stress and maximum heat dissipation press fit into heat sink to further enhance heat handling capability very low resistivity silicon die for lower operating junction temperature very low reverse current leakage for minimum energy loss
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